Spin Sonic Cleaning System
Even Submicron Particles on Wafers Can Be
Simultaneously Removed from Both Wafer Sides via
Non-Contact Cleaning
The Spin Sonic Cleaning System has realized high cleaning performance through Chemical-Fine-Jet and ED-Jet technology for horizontally placed wafers. The system can remove even submicron particles.
Chemical control and heating are no longer necessary as several processes have been eliminated.
Excellent cost performance is realized by reducing the cleaning time and the operational costs.
Features
High cleaning performance through Chemical Fine-Jet and 400kHz Fine-Jet technology.
Non-contact cleaning (blushless) protects wafer surface.
All the cleaning and drying process is conducted in a single chamber.
Cleaning process in the total room temperature needs no heater and promises big reduction in electricity consumption.
Components arrangement by function minimizes foot print and realizes a flexible layout.
Applications
Post/Pre epitaxial process.
Post CMP Cleaning.
Post polishing.
Pre Annealing.
Post/Pre Cleaning for CVD, nitride film, oxide film and etc.
Efficiency much improved with the leading-edge Super Clean System
Spin chamber
Fine jet nozzle
Fine jet generator
Chemical dispensing unit
Transfer robot
Loading/unloading unit
Example of the cleaning process of a Spin Sonic Cleaning System
